未封装芯片
返回 19 条匹配短语对
包装-封装-封装组件-套装软件
pack
OVP
倒装芯片封装
Filp chip packaging
FC
球栅阵列倒装-芯片封装
flip-chip ball grid array
热超声倒装芯片封装
Thermosonic Flip-chip Bonding
玻璃板上芯片封装
Accounting handover
倒装片封装
flip chip
flat pack
flag alarm
叠层芯片封装
stacked die packaging
stacked die package
叠层芯片封装元件
SCSP
多芯片封装
multi chip package
multi-chip package
Multi-chip package(MCP
Askja
MCP
多芯片封装技术
multi-chip packaging(MCP) technology
面阵列芯片封装互连
Planar array chip packaging interconnecting
无感裸芯片封装
non-inductive bare-chip packaging
芯片封装
chip package
chip encapsulation
chip assembly
chip packaging
Chip scale packaging
芯片封装质量
chip package quality
高阶通道监控未装装载终
HSUT:High -order path Supervision Unequipped Termination
扁平封装装置
flat pack assembler
垂直表面安装封装
VRMLvertical surface mount package
VSIPvertical surface mount package
VSB backplanevertical surface mount package
倒装封装
Flip-chip
封装装置
packaging system
packaging hardware
最近更新
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