晶圆级薄膜封装技术
wafer-lever thin-film packaging technique
晶圆级晶片尺寸封装
wafer-level chip-scale package WLCSP
MEMS封装技术
MEMS packaging technology
超薄型IC封装技术
packaging for ultra-thin ICs
电子封装技术
electronic encapsulating technology
Electronic packaging
叠层3D封装技术
stacked 3D packaging technology
多芯片封装技术
multi-chip packaging(MCP) technology
陶瓷封装技术
Ceramics packaging technology
微电子封装技术
microelectronics packaging technology
microelectronics packaging