晶圆级芯片尺寸封装
wafer level chip scale package
WCSP
晶圆级芯片贴装薄膜贴覆
Wafer Level Die Attach Film (WLDAF) Lamination
晶圆级晶片尺寸封装
wafer-level chip-scale package WLCSP
圆片级芯片尺寸封装
wafer-level chip scale packaging
wafer level chip scale package(WL-CSP
标准晶片级加速寿命试验
boundary element analysis
单片晶圆清洗
the Single Wafer Cleaning
发光二极体晶片、晶粒
LED Chips not for Communication
LED Chips for Communication
晶片级封装
wafer level chip scale package
晶圆级薄膜封装技术
wafer-lever thin-film packaging technique