球栅阵列倒装-芯片封装
flip-chip ball grid array
热超声倒装芯片封装
Thermosonic Flip-chip Bonding
多芯片封装技术
multi-chip packaging(MCP) technology
面阵列芯片封装互连
Planar array chip packaging interconnecting
无感裸芯片封装
non-inductive bare-chip packaging
高阶通道监控未装装载终
HSUT:High -order path Supervision Unequipped Termination
垂直表面安装封装
VRMLvertical surface mount package
VSIPvertical surface mount package
VSB backplanevertical surface mount package